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Jiwei.com news, not long ago, the PCB leader Shennan Circuit announced the results of the fixed increase. The company raised more than 2.5 billion yuan this time; the issue price was only 4% lower than the closing price on that day. It is worth noting that the list of objects of this issuance can be called "luxury Tiantu": in addition to the second phase of the National Integrated Circuit Fund (Big Fund), in addition to the subscription of 300 million yuan, Xiaomo, UBS AG, BNP and other foreign capital, as well as Caitong. , CEIBS, Nordisk and other fund companies also appeared. Behind the choice of the second phase of the big fund to invest in Shennan Circuits, does it mean that the PCB industry can win the favor of more funds in 2022? Industry competition: poor local structure and low bargaining power As the largest producer of the global PCB industry, China's share of the total output value of the global PCB industry has increased from 8% in 2000 to 54% in 2019, with a compound growth rate of 12.80%. However, the local PCB industry structure is very poor, the market share of the top ten is only 50.71%, and the competition is very sufficient, which leads to the weak bargaining power of industry companies in the industry chain, and the decline in profitability and risk transfer ability. Although there are many downstreams in the PCB industry, most of the main customers in communication electronics, consumer electronics, and automotive electronics have large-scale monopoly properties, such as Huawei, ZTE, Apple, Tesla, BOE and other strong industry giants, so PCB manufacturers are in the industry. Downstream giants have a very low voice, and some companies in the industry are even more like the service industry than the manufacturing industry. In addition to downstream companies, PCBs are also facing cost pressures brought about by rising prices of upstream materials. The main raw materials of PCB include copper clad laminate, copper foil and glass fiber cloth. Their supply and price fluctuations directly affect the production cost of PCB enterprises. Among them, PCB copper foil is the main raw material for manufacturing copper clad laminates, accounting for about 30% of the cost of copper clad laminates. (thick plate) ~ 50% (thin plate). Taking CCL as an example, the industry concentration is relatively high. The total market share of the top ten manufacturers in the world is about 75%. CCL manufacturers have stronger bargaining power, so PCB manufacturers are vulnerable to upstream extrusion, thus facing CCL enterprises. Pressure to shift raw material costs. Therefore, it is not difficult to see from the above analysis that the concentration of local PCB companies is not high, and they lack the right to speak in front of downstream giant companies, while the concentration of upstream copper clad laminate material manufacturers is high and has a stronger cost transfer ability... This also forms a local The competitive landscape of PCB enterprises is poor. A relevant person from Suntec Technology told Jiwei.com: "We judge that the price of materials will basically be in a stable downward channel in the next one or two years. In addition, the PCB manufacturing capacity is getting stronger and stronger, and some large domestic projects are expanding production. The higher the degree of automation, the lower the cost, so the price of PCB will be in a huge trend of decline in the future." Strong market demand for automotive PCBs Although the competition pattern of local PCB companies is poor, under the ultra-high-speed penetration of new energy vehicles into traditional fuel vehicles, automotive electronics, one of the three downstream applications of PCB, is expected to drive the expansion of the PCB market. According to Prismark data, the compound annual growth rate of global automotive PCB output value from 2019 to 2024 is 4.5%, which is higher than the industry average growth rate of 4.3%. The new four modernization trends in the automotive industry have contributed to the incremental source of automotive electronic PCBs, mainly due to the rapid penetration of new energy vehicles and the increase in the value of single-vehicle PCBs. According to the China Passenger Transport Association, in 2021, the retail sales of new energy vehicles in my country will reach 2.989 million, with a penetration rate of 14.8%, a significant increase from 5.8% in 2020. The sales volume is forecast to exceed 6 million in 2022. According to the characteristics of the S-shaped penetration rate curve, after the penetration rate of new energy vehicles exceeds 10% in 2021, the penetration rate of new energy vehicles will accelerate in the next few years, which means that the development of China's new energy vehicle industry will increase rapidly. Against the background of intensified competition in electrification, 2022 will undoubtedly become a critical year for the new pattern of global automotive PCBs. According to data from Strategy Analytics, the value of automotive electronics in hybrid vehicles and pure electric vehicles currently accounts for 47% and 65% of new energy vehicles, respectively. As the proportion of automotive electronics in the total vehicle cost continues to increase, it also drives the growth of automotive PCB demand. In addition to the increase in new energy vehicles, the increase in the value of single-vehicle PCBs is also an important factor driving the growth of the PCB market. In the past, gasoline vehicles were mainly made of ordinary multi-layer boards and double-sided boards. The consumption of a single vehicle was less than 1 square meter, and the value of PCB was relatively low, about 400-600 yuan per vehicle. In new energy vehicles, ADAS systems, display systems, battery systems, electric drive systems and electronic control systems all need to use a large number of PCB boards to carry various electronic components. The usage area of the PCB is increased by at least 3 times, and more attention is paid to the performance of the board, so the value of the PCB for a bicycle is significantly increased. Under the superposition of the above two factors, according to the calculations of CPCA, Tianfeng Securities and other institutions, the market space of new energy vehicle PCB boards from 2020 to 2025 will have a CAGR of 51%, with rapid growth, which also drives the overall automotive electronics PCB output value of 10% per year. % expansion. "The number of orders received by automotive PCB factories last year was extremely strong." According to industry insiders, this is mainly because the current PCB factories are driven by strong demand from the communications and consumer electronics industries, and the production capacity of high-end processes is tight. Next, speed up the ordering of automotive boards in preparation for rapid production after the chip problem is resolved. Can the PCB layout be changed? In fact, automotive PCBs are becoming an important performance booster for manufacturers, which is expected to change the low-end competition pattern of domestic PCBs. At the shareholders' meeting held recently, a relevant person from Chongda Technology told Jiwei.com, "The projects that have been mass-produced in the Zhuhai Phase I factory include automotive electronics-related products. Thanks to the existing customers' nearly 2-3 years of experience, The market share is growing rapidly. The sales revenue of the company's related products this year is expected to increase by nearly 150% compared with the same period last year, and the scale is expected to further expand in 2023. In 2023, the entire PCB board market will be dominated by automotive products." It is understood that the first phase of Chongda Technology will be put into trial production in the second quarter of 2021. It mainly produces 4-8 layers of large-scale PCB products used in the fields of automotive, central control, security, and optoelectronics. The annual design capacity is 2.7 million square meters, and the current capacity is climbing. The slope is relatively smooth, and other remaining production lines will be put into production step by step in 2022-2023 according to the market environment. Chongda Technology pointed out that the company's automotive PCB products are supplied to BMW, Mercedes-Benz, Volkswagen, Toyota and other automotive terminals; there are also PCB products that supply assisted driving systems, which are mainly used in vision systems, such as camera modules used in assisted driving, etc. . In the field of automotive electronics, with the development of the automotive industry, the application market of high-end PCB products will continue to expand, including but not limited to display modules, power control systems, sensors and other related components. FPC (flexible circuit board) has the advantages of high integration, automated assembly, large-scale cost reduction, high efficiency, safety and reliability, and light weight. It is suitable for power battery wiring harnesses, and may replace traditional copper wiring harnesses in the future. Calculated by using 6-16 battery modules of a new energy vehicle, each module uses 1-2 FPCs, and the FPC usage of a single vehicle will also be greatly increased

In 2022, the three-level linkage of provinces, cities and counties to promote the commencement of major projects and the "Project Conference" will be held on February 16 in Longnan City, Jingde City, Xinyu City, Wuning County, Nancheng County and other places. Yi Lianhong, Secretary of the Provincial Party Committee, issued an order to start construction, and Ye Jianchun, Deputy Secretary of the Provincial Party Committee and Governor, delivered an important speech. Image source: 2022 Provincial, Municipal and County Three-Level Linkage Major Project Mobilization Conference Among them, there are 15 major projects in Longnan City, with a total investment of 14 billion yuan; 175 major projects in Jingde City, with a total investment of 168.456 billion yuan; 67 major projects in Xinyu City, with a total investment of 36.4 billion yuan; 48 major projects in Wuning County, with a total investment of 48 26.054 billion yuan; 31 major projects in Nancheng County with a total investment of 19.39 billion yuan. These new major projects are under construction, ushering in a new era of massive capacity expansion. It is worth noting that there are four major PCB projects in Longnan City. Jiangxi Wujiang High-tech Co., Ltd. Project Name: Photosensitive Dry Film Resin Electronic Chemical Materials Project (Phase I) Company name: Jiangxi Wujiang High-tech Materials Co., Ltd. Construction site: Fukang Industrial Park, Economic and Technological Development Zone, Longnan City, Ganzhou City Project investment: 2 billion yuan Project overview: The project will be constructed in two phases, with a total area of 145 mu. The first phase will invest 873.19 million yuan. It is planned to build workshops (including workshops), office buildings, warehouses and other supporting facilities, with a total construction area of 47,009 square meters, and equipment to be purchased. Reactor/tank system, optical precision coating system, optical high-speed slitting machine system, oxidation regenerative incinerator, raw material storage tank, 10,000-level purification system and other equipment. After the project is put into operation, it can produce 300 million square meters of photosensitive dryers per year. Film, 24,000 tons of resin, 1,200 tons of electronic chemical materials. Boyu Electronics Project name: Metal-based copper clad laminate and circuit board production project Company name: Jiangxi Boyu Electronics Co., Ltd. Construction site: Xinzhen Electronic Information Industrial Park, Longnan Economic and Technological Development Zone Project investment: 500 million yuan Project overview: The project covers an area of 62.43 mu, with a total construction area of about 59,000 square meters. It mainly builds workshops, Class A warehouses, dormitories, equipment rooms, guards and other ancillary facilities. The estimated annual output value of the project is 1.7 billion yuan. Guangzhen Materials Project name: Project with an annual output of 50,000 tons of electronic photosensitive materials and supporting materials Company name: Jiangxi Guangzhen Photosensitive Materials Co., Ltd. Construction site: Longnan Economic Development Fukang-Xinzhen Area Renewable Resources and Chemical Industry Park Project investment: 1 billion yuan Project overview: The total area is 154.31 mu. After the project is completed, it will have an annual production capacity of 7,000 tons of photoresist and supporting reagents, 12,000 tons of self-made resin, 16,000 tons of PCB ink, and 15,000 tons of paint. After the project reaches the production target, the annual output value will reach more than 1.4 billion yuan. Hong Kong Universal Group Project name: PCB automation and intelligent equipment manufacturing Company name: Universal Semiconductor Packaging Equipment Co., Ltd. Construction site: Industrial Park, Longnan City, Ganzhou Project investment: 300 million yuan Project overview: The project is constructed in two phases, of which the investment of the first phase is 200 million yuan, the investment of fixed assets is 150 million yuan, and the total investment of the second phase is 100 million yuan, and the investment of fixed assets is 50 million yuan. Covering an area of 56.8 acres, the total construction area is about 54,915 square meters. The first phase mainly builds high-end automation and intelligent equipment supporting production lines, with a construction area of 28,870 square meters. After the project is completed, the overall production is expected to reach an annual output value of 250-300 million yuan.

One of the world's most influential and representative circuit and electronic assembly exhibitions - 2018 International Circuit Board and Electronic Assembly South China Exhibition opened at Shenzhen Convention and Exhibition Center. Founder PCB, a subsidiary of Founder Technology Group Co., Ltd. (hereinafter referred to as "Founder Technology"), participated in the exhibition and displayed high-quality products in the field of printed circuit board business and intelligent manufacturing. Founder PCB display products have attracted widespread attention With the business philosophy of "technology and quality dual drive", Founder PCB has maintained an industry-leading position in the field of printed circuit boards since its establishment. After 30 years of development, it now has 4 production plants and a PCB research institute, with an annual production capacity of 15 million square feet. In addition, the printed circuit board smart factory built by Founder PCB, as a representative project of China's high-end intelligent circuit board industry, has entered a period of rapid construction. It is expected to be completed and put into production in 2019. At that time, high-end intelligent circuit boards will get rid of intensive production. mode, to achieve intelligent warehousing and high-end automated production methods, so as to greatly increase production efficiency by more than 30% and help the development of China's high-end PCB industry. exhibition site The exhibits at this exhibition not only include circuit boards, but also comprehensively cover the entire supply chain of innovative equipment and technologies in the electronic assembly industry. Sun Yukai, President of Founder PCB, a subsidiary of Founder Technology, said that participating in this conference is to understand the latest product technology in the industry, help Founder PCB to improve efficiency and quality, and reduce costs; on the other hand, he hopes to find more excellent cooperation. Partner and attract the best cutting-edge talents in the industry. In recent years, China's international status in the field of semiconductor manufacturing has been continuously improved. As a pioneer in promoting the continuous development of China's intelligent manufacturing, Founder PCB is actively seeking upstream and downstream partners around the world to jointly expand the global market while cultivating technology. At the exhibition, Founder PCB's 5G base station communication boards, HDI mobile phone boards, computing/storage boards and other cutting-edge products attracted the attention of many exhibitors at home and abroad. Negotiate with overseas partners At present, Founder PCB's business partners include Huawei, ZTE, Dell, Cisco and other world-renowned manufacturers, and their business scope covers the world. In the future, Founder PCB will work hand in hand with more partners to welcome the arrival of the 5G era and contribute to Chinese manufacturing.

5G millimeter-wave mobile phone RF chip heat dissipation wave-transmitting insulating material Keywords in the 5G era: 5G millimeter wave (Microwave radio frequency board), radio frequency chip (originality electronics IC), TIM material, wave-transmitting insulating thermal conductive film, PCB domestic new material RF front-end for mobile phone wireless communication....

Basic rules of component layout 1. Layout according to circuit modules, and related circuits that realize the same function are called a module. The components in the circuit module should adopt the principle of nearby concentration, and the digital circuit and the analog circuit should be separated; 2. No components or devices shall be mounted within 1.27mm of non-mounting holes such as positioning holes, standard holes, and 3.5mm (for M2.5) and 4mm (for M3) of 3.5mm (for M2.5) and 4mm (for M3) shall not be allowed to mount components; 3. Avoid placing via holes under the components such as horizontal resistors, power inductors (plug-ins), electrolytic capacitors, etc., so as to avoid short circuit between the via holes and the component shell after wave soldering; 4. The distance between the outside of the component and the edge of the board is 5mm; 5. The distance between the outside of the mounting component pad and the outside of the adjacent interposing component is greater than 2mm; 6. Metal shell components and metal parts (shielding boxes, etc.) cannot touch other components, and cannot be close to printed lines and pads, and their spacing should be greater than 2mm. The size of positioning holes, fastener installation holes, oval holes and other square holes in the board from the outside of the board edge is greater than 3mm; 7. Heating elements should not be in close proximity to wires and heat-sensitive elements; high-heating elements should be evenly distributed; 8. The power socket should be arranged around the printed board as far as possible, and the power socket and the bus bar terminal connected to it should be arranged on the same side. Particular attention should be paid not to arrange power sockets and other welding connectors between the connectors to facilitate the welding of these sockets and connectors, as well as the design and tie-up of power cables. The arrangement spacing of power sockets and welding connectors should be considered to facilitate the plugging and unplugging of power plugs; 9. Arrangement of other components: All IC components are aligned on one side, and the polarity of the polar components is clearly marked. The polarity of the same printed board cannot be marked in more than two directions. When two directions appear, the two directions are perpendicular to each other; 10. The wiring on the board surface should be dense and dense. When the density difference is too large, it should be filled with mesh copper foil, and the grid should be larger than 8mil (or 0.2mm); 11. There should be no through holes on the SMD pads to avoid the loss of solder paste and cause false soldering of the components. Important signal lines are not allowed to pass between the socket pins; 12. The patch is aligned on one side, the character direction is the same, and the packaging direction is the same; 13. The polarized components should be kept consistent as far as possible on the same board as possible. Two, component wiring rules 1. Draw the wiring area within 1mm from the edge of the PCB board, and within 1mm around the mounting hole, wiring is forbidden; 2. The power line should be as wide as possible and should not be less than 18mil; the signal line width should not be less than 12mil; the cpu input and output lines should not be less than 10mil (or 8mil); the line spacing should not be less than 10mil; 3, the normal via is not less than 30mil; 4, dual in-line: 60mil pad, 40mil aperture; 1/4W resistance: 51*55mil (0805 surface mount); when in-line, the pad is 62mil and the aperture is 42mil; Infinite capacitor: 51*55mil (0805 surface mount); when in-line, the pad is 50mil and the aperture is 28mil; 5. Note that the power line and the ground line should be as radial as possible, and the signal line should not be looped. How to improve anti-interference ability and electromagnetic compatibility? How to improve the anti-interference ability and electromagnetic compatibility when developing electronic products with processors? 1. The following systems should pay special attention to anti-electromagnetic interference: (1) A system with a very high microcontroller clock frequency and a very fast bus cycle. (2) The system contains high-power, high-current drive circuits, such as spark-producing relays, high-current switches, etc. (3) A system containing a weak analog signal circuit and a high-precision A/D conversion circuit. 2. Take the following measures to increase the anti-electromagnetic interference capability of the system: (1) Choose a microcontroller with low frequency: The use of a microcontroller with a low external clock frequency can effectively reduce noise and improve the system's anti-interference ability. For the square wave and sine wave of the same frequency, the high frequency components in the square wave are much more than that in the sine wave. Although the amplitude of the high-frequency component of the square wave is smaller than the fundamental wave, the higher the frequency, the easier it is to emit as a noise source. The influential high-frequency noise generated by the microcontroller is about 3 times the clock frequency. (2) Reduce distortion in signal transmission Microcontrollers are mainly manufactured using high-speed CMOS technology. The static input current of the signal input terminal is about 1mA, the input capacitance is about 10PF, and the input impedance is quite high. The output terminal of the high-speed CMOS circuit has a considerable load capacity, that is, a relatively large output value. The long wire leads to the input end with relatively high input impedance, the reflection problem is very serious, it will cause signal distortion and increase system noise. When Tpd>Tr, it becomes a transmission line problem, and problems such as signal reflection and impedance matching must be considered. The delay time of the signal on the printed circuit board is related to the characteristic impedance of the lead, that is, it is related to the dielectric constant of the printed circuit board material. It can be roughly considered that the transmission speed of the signal on the printed board leads is about 1/3 to 1/2 of the speed of light. The Tr (standard delay time) of the commonly used logic phone components in a system composed of a microcontroller is between 3 and 18 ns. On the printed circuit board, the signal passes through a 7W resistor and a 25cm-long lead, and the line delay time is roughly between 4-20ns. In other words, the shorter the lead of the signal on the printed circuit, the better, and the length should not exceed 25cm. And the number of vias should also be as small as possible, no more than two. When the signal's rise time is faster than the signal delay time, it must be processed in accordance with fast electronics. At this time, the impedance matching of the transmission line should be considered. For the signal transmission between integrated blocks on a printed circuit board, the situation of Td>Trd should be avoided. The larger the printed circuit board, the less the system speed can be too fast. summarize a rule of printed circuit board design with the following conclusions: The signal is transmitted on the printed board, and its delay time should not be greater than the nominal delay time of the device used. (3) Reduce the mutual interference between signal lines: A step signal with a rise time of Tr is transmitted to the B terminal through the lead AB. The delay time of the signal on the AB line is Td. At point D, due to the forward transmission of the signal from point A, the signal reflection after reaching point B and the delay of the AB line, a page pulse signal with a width of Tr will be induced after Td time. At point C, due to the transmission and reflection of the signal on AB, a positive pulse signal with a width of twice the delay time of the signal on the AB line, that is, 2Td, is induced. This is the cross-interference between signals. The intensity of the interference signal is related to the di/at of the C point signal and the distance between the lines. When the two signal lines are not very long, what you see on AB is actually the superposition of two pulses. The micro-control made by CMOS process has high input impedance, high noise, and high noise tolerance. The digital circuit is superimposed with 100-200mv noise and does not affect its operation. If the AB line in the figure is an analog signal, this interference becomes intolerable. For example, when the printed circuit board is a four-layer board, one of which is a large-area ground, or a double-sided board, when the reverse side of the signal line is a large-area ground, the cross-interference between such signals will be reduced. The reason is that the large-area ground reduces the characteristic impedance of the signal line, and the reflection of the signal at the D end is greatly reduced. The characteristic impedance is inversely proportional to the square of the dielectric constant of the medium from the signal line to the ground, and proportional to the natural logarithm of the thickness of the medium. If the AB line is an analog signal, to avoid the interference of the digital circuit signal line CD to AB, there should be a large area under the AB line, and the distance between the AB line and the CD line should be greater than 2 to 3 times the distance between the AB line and the ground. It can be partially shielded, and ground wires are placed on the left and right sides of the lead on the side with the lead. (4) Reduce the noise from the power supply While the power supply provides energy to the system, it also adds its noise to the power supply. The reset line, interrupt line, and other control lines of the microcontroller in the circuit are easily disturbed by external noise. Strong interference on the power grid enters the circuit through the power supply. Even in a battery-powered system, the battery itself has high-frequency noise. The analog signal in the analog circuit is even less able to withstand the interference from the power supply. (5) Pay attention to the high frequency characteristics of printed wiring boards and components In the case of high frequency, the leads, vias, resistors, capacitors, and the distributed inductance and capacitance of the connectors on the printed circuit board cannot be ignored. The distributed inductance of the capacitor cannot be ignored, and the distributed capacitance of the inductor cannot be ignored. The resistance produces the reflection of the high-frequency signal, and the distributed capacitance of the lead will play a role. When the length is greater than 1/20 of the corresponding wavelength of the noise frequency, an antenna effect is produced, and the noise is emitted through the lead. The via hole of the printed circuit board causes about 0.6pf capacitance. The packaging material of an integrated circuit itself introduces 2~6pf capacitors. A connector on a circuit board has a distributed inductance of 520nH. A dual-in-line 24-pin integrated circuit skewer introduces 4-18nH distributed inductance. These small distribution parameters are negligible in this line of low-frequency microcontroller systems; and special attention must be paid to high-speed systems. (6) The layout of components should be reasonably divided The position of the components on the printed circuit board should fully consider the problem of anti-electromagnetic interference. One of the principles is that the leads between the components should be as short as possible. In the layout, the analog signal part, the high-speed digital circuit part, and the noise source part (such as relays, high-current switches, etc.) should be reasonably separated so that the signal coupling between each other is small. G handle the grounding wire: On the printed circuit board, the power line and the ground line are important. The main method to overcome electromagnetic interference is grounding. For the double-sided board, the ground wire layout is very particular. Through the single-point grounding method, the power supply and the ground are connected to the printed circuit board from both ends of the power supply. The power supply has one contact and the ground has one contact. On the printed circuit board, there must be multiple return ground wires, which will be gathered on the contact point of the return power supply, which is the so-called single-point grounding. The so-called analog ground, digital ground, and high-power device ground division means that the wiring is separated, and then they are all collected at this grounding point. When connecting with signals other than printed circuit boards, shielded cables are usually used. For high frequency and digital signals, both ends of the shielded cable are grounded. One end of the shielded cable for low-frequency analog signals should be grounded. Circuits that are very sensitive to noise and interference or circuits that have severe high-frequency noise should be shielded with a metal cover. (7) Use decoupling capacitors. Good high-frequency decoupling capacitors can remove high-frequency components as high as 1GHZ. Ceramic chip capacitors or multilayer ceramic capacitors have better high-frequency characteristics. When designing a printed circuit board, a decoupling capacitor must be added between the power and ground of each integrated circuit. The decoupling capacitor has two functions: on the one hand, it is the energy storage capacitor of the integrated circuit, which provides and absorbs the charging and discharging energy at the moment of opening and closing the integrated circuit; on the other hand, it bypasses the high-frequency noise of the device. The typical decoupling capacitor in the digital circuit is 0.1uf. The decoupling capacitor has a distributed inductance of 5nH. Its parallel resonance frequency is about 7MHz, which means that it has a better decoupling effect for noise below 10MHz. Noise has little effect. 1uf, 10uf capacitor, parallel resonance frequency is above 20MHz, the effect of removing high frequency noise is better. It is often advantageous to use a 1uf or 10uf high frequency removal capacitor where the power enters the printed board, even for battery-powered systems. Every 10 pieces of integrated circuits need to add a charge and discharge capacitor, or called a storage and discharge capacitor, the size of the capacitor can be 10uf. Fortunately, there is no need for electrolytic capacitors. Electrolytic capacitors are rolled up with two layers of pu film. This rolled-up structure behaves as an inductance at high frequencies, so it is better to use bile capacitors or polycarbonate capacitors. The selection of the decoupling capacitor value is not strict, and it can be calculated as C=1/f; that is, 0.1uf for 10MHz, and for a system composed of a microcontroller, it can be between 0.1uf and 0.01uf. 3. Some experience in reducing noise and electromagnetic interference. (1) Low-speed chips can be used instead of high-speed chips. High-speed chips are used in key places. (2) A resistor can be connected in series to reduce the jump rate of the upper and lower edges of the control circuit. (3) Try to provide some form of damping for relays, etc. (4) Use a low-frequency clock that meets the system requirements. (5) The clock generator is as close as possible to the device using the clock. The shell of the quartz crystal oscillator should be grounded. (6) Enclose the clock area with a ground wire, and keep the clock wire as short as possible. (7) The I/O drive circuit should be as close as possible to the edge of the printed board, and let it leave the printed board as soon as possible. The signal entering the printed board should be filtered, and the signal from the high-noise area should also be filtered. At the same time, a series of terminal resistors should be used to reduce signal reflection. (8) The useless terminal of MCD should be connected to high, or grounded, or defined as the output terminal, and the terminal that should be connected to the power supply ground on the integrated circuit should be connected to it, not to be left floating. (9) Do not leave the input terminal of the gate circuit that is not in use. The positive input terminal of the unused op amp is grounded, and the negative input terminal is connected to the output terminal. (10) The printed board should try to use 45-fold lines instead of 90-fold lines to reduce the external emission and coupling of high-frequency signals. (11) The printed boards are divided according to frequency and current switching characteristics, and the noise components and non-noise components should be farther apart. (12) Single-point power supply and single-point grounding are used for single and double panels. The power line and ground line should be as thick as possible. If the economy is affordable, use a multilayer board to reduce the capacitive inductance of the power supply and ground. (13) The clock, bus, and chip select signals should be far away from I/O lines and connectors. (14) The analog voltage input line and the reference voltage terminal should be as far away as possible from the digital circuit signal line, especially the clock. (15) For A/D devices, the digital part and the analog part should be unified rather than crossed. (16) The clock line perpendicular to the I/O line has less interference than the parallel I/O line, and the clock component pins are far away from the I/O cable. (17) The component pins should be as short as possible, and the decoupling capacitor pins should be as short as possible. (18) The key line should be as thick as possible, and protective ground should be added on both sides. The high-speed line should be short and straight. (19) The noise-sensitive wire should not be parallel to the high-current, high-speed switching wire. (20) Do not route wires under the quartz crystal and under noise-sensitive devices. (21) For weak signal circuits, do not form current loops around low-frequency circuits. (22) Do not form a loop for any signal. If it is unavoidable, make the loop area as small as possible. (23) One decoupling capacitor per integrated circuit. A small high-frequency bypass capacitor must be added to each electrolytic capacitor. (24) Use large-capacity tantalum capacitors or ju-cool capacitors instead of electrolytic capacitors for circuit charging and discharging energy storage capacitors. When using tubular capacitors, the case should be grounded.

Recently, the PCB sector has quietly strengthened. Last week, in sharp contrast with the sharp fluctuations in the index, a number of PCB concept stocks gained better momentum, with Shiyun Circuits, Shanghai Electronics Co., Ltd., Suntak Technology, Jingwang Electronics, and Shennan Circuits rising more than 10%. If you look back on the timeline, since the fourth quarter, the PCB sector has performed equally well: 27 of the 34 PCB concept stocks recorded positive returns. The three main lines of new energy bring huge incremental space Previously, PCBs were mostly closely connected with concepts such as consumer electronics and 5G. However, as the development of new energy vehicles has gradually improved, the application of PCBs in automotive electronics has also begun to attract market attention. On the one hand, in the automotive industry, PCBs are mainly used for assisted driving, in-vehicle communications, and electric control. For traditional fuel vehicles, the average PCB consumption is 1 square meter, while that of high-end models is 2-3 square meters. The value of PCB for bicycles is about 500-600 yuan. However, due to the addition of BMS, MCU and other devices to new energy vehicles, the PCB area has increased to 3-5 square meters, and the value of PCBs for bicycles exceeds RMB 2,000, which is four times that of traditional fuel vehicles. Prismark data show that last year, the global automotive PCB output value was US$6.19 billion, and it is estimated that the output value will reach US$8.75 billion in 2024, accounting for 10.6% of the total global PCB output value, and the compound growth rate in 2020-2024 can reach 9%. On the other hand, it is the subdivision field FPC (flexible circuit board/soft board). In traditional fuel vehicles, the amount of bicycle FPC is about 100 or more. It is mainly used in vehicle display groups and vehicle electronic equipment, engine systems, seats, doors, vehicle control and other electronic control automatic systems, and vehicle imaging systems and sensors. system. In new energy, both power batteries and energy storage batteries open up new capacity for FPC. In the power battery segment, FPC has become one of the new materials selected by manufacturers to reduce costs. It has significant advantages in safety performance, lightweight, process flexibility, and automated production. It has been awarded by Ningde Times, BYD, Guoxuan High-tech , AVIC Lithium Battery, Tafel, Funeng Technology and many other enterprise applications.

PCB warfare is everywhere, who can seize the opportunity? With the opportunities and saturation of the global PCB market, the battle for printed circuit board manufacturers has shifted from the stock market to the incremental market. Both small and medium-sized manufacturers and industry giants have realized that the low-price mass market that was originally the mainstay can no longer bring greater profits to them. Finding the next "export" business has become the focus of business expansion in recent years. Under the continuous promotion of industry development and the wave of domestic substitution, many companies have begun to set foot in the PCB field in recent years, which has also attracted more and more capital influx. Major corporate giants are aiming at the hot and huge potential PCB blue ocean market, and are increasing their investment, and it is inevitable that they will meet again in a narrow way. Who can rein in the situation, break the pattern, and occupy a place in the huge PCB market? People are looking forward to... In the fiercely competitive market pattern, PCB products have a wide variety of products, a wide range of applications, a high degree of customization, and the competitive landscape of downstream industries is relatively fragmented. When many companies try their best to catch up with their peers, they are not only targeting one market, but also targeting other areas. As the market continues to heat up, similarly, in addition to the main battlefield, other companies are also looking for a second growth curve. All electronics-related fields such as consumer electronics, computers, communications, automobiles, and industrial medical care require PCBs. In different industries In the field of the market, the major manufacturers also meet on a narrow road, and the war is spreading and becoming more and more fierce. The competitive landscape of the global printed circuit board PCB market has also undergone major changes. With the continuous upgrading of industry equipment, product requirements are getting higher and higher, and the demand for high-end, multi-functional PCBs continues to increase. Many PCB manufacturers who were originally hovering in the mid-end market have begun a fierce upward "attack", trying to impact the high-end market through product iterations, and are also increasing investment in advanced manufacturing processes, but it is not easy. They want to enter the high-end market. , Not only does the product constantly need to be updated and iterated, but more importantly, it is the combination of technology, R&D, and production capacity. Technology is always iterating, the market is always changing, and no one will always be a winner. Regarding the current development trend of the PCB market, Prismark predicts that by 2024, the PCB output value in mainland China is expected to reach 41.77 billion U.S. dollars, accounting for 55.1%, and the industry is expected to usher in rapid development. With the consumption upgrade, the demand for new products and technologies and the widespread application of intelligent manufacturing, therefore, without losing the main market, various PCB companies have begun to try other new fields. With the blessing of intelligence and networking, the development of downstream industries has shown a sustained upward trend, and PCB boards have become the most powerful application market. This has also become a major incentive for many companies to enter the field across borders. So far, with its mature experience and advanced technology accumulated in the field of PCB manufacturing, the manufacturing workshop has focused on building an independent supply chain. With the help of research and development capabilities and ultra-high technology, it provides high-quality product solutions that are widely used in power, smart hardware, Breakthroughs have been made in various fields such as communications, medical care, automobiles, industrial control, and the Internet of Things. In the current period of accelerating industrial digitization, the manufacturing workshop is seizing the opportunity to accelerate the deepening of the layout of the PCB market.

The July issue of PCB007 China Online Magazine takes "Fully Automatic PCB Factory" as the theme. Faced with the pressure of cost, delivery time and manufacturing process, the full-automatic PCB factory is the general trend. With this as the topic, we specially interviewed Mr. Zhou Dingzhong, the operation director of Victory Hong Technology (Huizhou) Co., Ltd., the first domestic PCB manufacturer with full process, entire factory, and large-scale implementation of intelligent. Discrimination and analysis of various complicated sounds lingering in the proposition of PCB smart factory. Victory Macro Technology (Huizhou) Co., Ltd. (300476) has always been the world's largest supplier of high-density multilayer VGA (graphics card) PCBs. At the same time, the company has laid out new energy automotive circuit boards, servers, industrial control and other high value-added applications. Thanks to the intelligent production workshop invested in 2015 that has gradually reached production, it has brought the company a substantial increase in production capacity and also saved the company a lot of labor costs. The most obvious is the copper clad laminate and copper foil since last year. Instead, the company`s supply chain channel advantages have been fully demonstrated. Opinion collision: Reporter: As a forerunner of a PCB smart factory--what is Shenghong's current actions on the smart factory project, and what are the effects? Can you introduce it? Mr. Zhou: The pressure of global market competition is increasing, the life cycle of electronic products is getting shorter and shorter, and the market has higher and higher requirements for PCB board manufacturers. In order to conform to the trend of the development of the times, Shenghong currently invests 1.12 billion Yuan Renminbi, committed to building a smart factory based on Industry 4.0 standards, fully realizing "production automation, unmanned logistics, intelligent scheduling, and digital management". Through the comprehensive innovation and intelligent transformation of the production process, the output value of 1 billion can be completed by only 350 people, and the delivery time has been shortened from 5-7 days in the same industry to 36 hours. Advertising smt processing, Jingbang ERP real-time follow-up order, patch, assembly one-stop service, proxy procurement of components, ^^ smt processing, labor and materials. PCB circuit board production, pcb... Reporter: Do you think that a high automation starting point can produce high production benefits? Victory "Machine substitution" is at the forefront of the industry, with an output value of 1 billion that can be completed by only 350 people. Is the per capita output value a measure of the success of automation? The key factors to control? (For example, how people, machines, and information interaction work together perfectly in a modern manufacturing environment is the essence of automation) Mr. Zhou: A high automation starting point does not necessarily produce high benefits. High benefits come from system engineering. We start with IE for overall planning, and use automation and information methods to achieve the lowest overall cost, the shortest delivery time, the highest production capacity, and the best quality. ! The per capita output value is one of the important indicators to measure the success of automation, but the more critical factor we believe is the return on investment. If the investment in automation can bring "cost reduction, shorter delivery time, and quality improvement", then the project is a success! Reporter: Some experts said, "China's automation level is lagging behind, but we should not underestimate ourselves, because China has the world's most complete manufacturing ecology." How do you understand Shenghong's smart factory route along the way and what pressures are encountered ? How is it solved? Can you cite some practical cases? Mr. Zhou: China does have the most complete manufacturing ecology in the world. In the process of Shenghong's construction of the entire smart factory, within the two-hour economic circle of the Pearl River Delta, we can find 80% of the equipment vendors that our project needs, and they are very Willing to work with us to upgrade and innovate the equipment is an important foundation for the success of our project. We have been advancing the smart factory all the way, and the biggest pressure we have encountered is standardization. In the past, automation mainly focused on partial automation. Now we are focusing on the entire factory. If we do not realize the standardization of the tools and tools of the front and rear processes, the automation of logistics cannot be realized. It is impossible to achieve perfect informatization without realizing the standardization of the communication protocols of equipment from different manufacturers. Therefore, the issue of standardization has always been a barrier to the advancement of smart factories. Based on the principle of "collaborative innovation", we will discuss together with equipment manufacturers and jointly formulate standards. For example, we have solved the problem of loading and unloading vehicles in different stages of the production process; we have also solved the problem of standardization of communication protocols of different equipment manufacturers. Cooperation, joint innovation, and open interconnection must be the only way for future intelligent manufacturing. H.C.C. has two production plants for PCB and PCBA, which can undertake PCB assembly services. The main products are consumer electronics, medical equipment, industrial... Reporter: From the external environment, Chinese local manufacturers still encounter some disadvantages in the automation of factory system management. How did Shenghong solve it? For system manufacturers, what are the good suggestions and opinions? Mr. Zhou: Indeed, some of our core process production equipment is currently partially dependent on foreign manufacturers, and it is more difficult for foreign manufacturers to communicate in terms of cooperation and coordination. For these factors, we have clearly included the requirements for intelligence in the equipment procurement link. As a user, our biggest suggestion to system manufacturers is to "group development and win the future", targeting the PCB industry and automation manufacturers in different links. It is necessary to form an alliance to jointly participate in the overall R&D and innovation of the smart factory. Reporter: Professor Tang Min, Counselor of the State Council, once said: "In the future, it is unstoppable for China to move labor-intensive industries that win with mass production and low cost to Southeast Asia. The only thing China can leave is small-batch, customized flexible manufacturing capacity. "For some manufacturers, the pure pursuit of "machine substitution" oriented by automated equipment, mass production, and reduction of manufacturing costs may have traps. Because how to use industrial robots, use advanced automated management platforms, and use information technology to help companies achieve flexible production and agile manufacturing, this is the key. "Machine replacement" is to achieve software flexibility, agile programming, or automatic programming, just like "quick mold change" in TPS (transaction processing system). What do you think of these points of view, and what is Shenghong's current progress? Mr. Zhou: We agree that machine replacement must consider the combination of "automation and flexibility". The realization of mass production by automation alone cannot maximize the overall benefits of the enterprise. Shenghong's smart factory emphasizes intelligence. We The designed production line can not only realize large-scale automated production, but also can be compatible with small-scale, customized flexible manufacturing. At present, all the production equipment we plan have achieved information networking, from the release of production instructions, the release of process parameters, The quality control, warehousing, handling, and loading and unloading of the production process have all realized digital control, that is, the production line can realize "quick mold change and mixed-flow production". Reporter: As the leader of the new wave of the new industrial revolution, does Shenghong have anything to say about the entire industry chain? Do you hope that various suppliers will join the smart factory express in what mode? Mr. Zhou: For the entire industry chain, "openness, interconnection, and collaboration" are what I want to say. As a PCB manufacturer, we hope to cooperate with our upstream and downstream. The future competition must be the competition of the industry chain, so between each other It is necessary to work closely together to establish an industry sharing platform. The future of manufacturing is the era of network collaborative manufacturing. Manufacturing entities need to further transform into manufacturing platform enterprises and build Alibaba in the PCB manufacturing industry. Various needs and production resources become the platform One node realizes the optimal allocation and coordination of the resources of the whole society. As a pioneer of smart factories, Shenghong is willing to export experience and models to the same industry to help the entire PCB industry improve and develop. At the same time, we will also establish an intelligent manufacturing innovation research institute in the PCB industry to gather resources from all parties and carry out continuous innovation. Mr. Zhou: After reading the relevant introduction of the WHELEN factory, we are mixed. What is happy is that the wave of global manufacturing upgrades is unstoppable. Large-scale implementation of intelligence "Shenghong should be the first in the world. We hope that through its attempts in smart factories, we will share our experience with our peers and drive the development of China's PCB industry. The worry is that we are facing global industry competition, and we are also facing challenges from our American counterparts. Only by continuous learning and pioneering innovation can we keep up with the pace of the times. Reporter: As a pioneer on the road to a PCB smart factory, Shenghong is bound to shoulder a major mission and responsibility. Thank you very much Mr. Zhou for your wonderful and unique analysis. I believe that the road of China's intelligent PCB factory will definitely become more and more spacious! Mr. Zhou: Thanks!

Since the beginning of this year, many metal prices have shown a rapid upward trend, which has also greatly affected many mid- and downstream industries. I have also told you a lot before. Recently, the fluctuation of copper prices has gradually stabilized. Today, let`s take a look at its related downstream PCB industry, that is, the circuit board industry. What is its logic. The raw material required for PCB production is copper. Specifically, the cost of its raw materials is the copper clad laminate (CCL). In the cost of the copper clad laminate, glass fiber cloth, copper foil, and epoxy resin together account for more than 70 %, the proportion of copper foil will reach about 40%. In this way, the fluctuation of copper price will have a great impact on the cost of PCB production. Copper foil is a capital-intensive industry with a high degree of market concentration. The top 5 industry has a market share of 50%. It has strong bargaining power for the downstream, especially when copper foil inventories are in short supply. Copper foil manufacturers have a stronger voice in prices. . Therefore, copper clad laminate manufacturers have the ability to transfer rising raw material prices through price increases, and smoothly transfer costs to downstream PCBs, in order to maintain or even increase gross profit margins. In this way, the performance of PCB companies will be compressed. From the relevant data, we can see that from last year to the third quarter of this year, copper clad laminate companies have experienced several price increases. However, after entering the third quarter of this year, the pace of price increases of various copper clad laminate manufacturers has slowed down significantly, and only a few manufacturers have responded. The prices of some products have increased slightly. Does this mean that the prices of upstream raw materials are gradually stabilizing, the production capacity of copper clad laminates will be further released, and the price of copper clad laminates will gradually stabilize? Then its downstream PCB will gradually pass on the cost to the downstream, and profitability is also expected to recover? In addition to the impact of raw materials, another factor to be mentioned here is the impact of the appreciation of the renminbi. At present, the overseas revenues of several leading companies will account for a relatively large proportion. For example, the overseas revenues of World Games Circuits accounted for up to 86%, and the overseas revenues of Pengding Holdings, Shanghai Electric Co., Ltd., and Shennan Circuits accounted for 71% respectively. , 64%, 64%. When the renminbi appreciates, great exchange losses will occur. Now the renminbi exchange rate has stabilized, and the impact of exchange losses on the profitability of companies has also become smaller. In the context of stabilizing upstream costs, let's see if its downstream demand is booming. Although this logic is good, everyone should pay more attention to the changes in the prices of upstream raw materials, because the current attitudes of various institutions to their price trends are different. If the prices of upstream raw materials rise sharply again, they will be The performance of the enterprise has a great impact.

Reliable multilayer board manufacturer www.pcbcoming.com. has been committed to becoming a highly reliable multilayer board manufacturer, investing in the construction of a PCB industrial park covering an area of 205 acres, with its own environmental protection qualifications. Only purchase high-precision equipment such as Taiwan Dongtai drilling machine, Japanese famous machine (MEIKI) vacuum heat press, Taiwan Mingming plating line, cosmic horizontal line, high-end LDI laser exposure machine, digital inkjet character printer, German imported flying probe tester Advanced equipment such as Shengyi/Kingboard A-level copper clad laminate, solar ink and other high-quality raw materials are carefully selected. Passed ISO9001, ISO14001, IATF16949 (automotive certification), UL multilayer board, CQC, REACH, GB-T29490 and other full series of quality management system, environmental management system and intellectual property management system certification; and passed the self-developed MES system strictly Process control, data control and visualization control to achieve high-reliability product delivery.

PCB Industry Special Report The copper clad laminate has a significant increase due to the impact of raw materials, and it is expected to fluctuate at a high level in the later period. 1) Copper foil: Supply/currency/demand drives up the price of copper. The average value of LME copper in June 2021 was US$9632/ton, +67% year-on-year. Low copper inventories pushed up copper prices. As the epidemic in major copper producing countries eases, the easing of copper mine supply and demand will drive the cost of copper foil to stabilize; 2) Epoxy resin: 2020/8-2021/4 cumulative increase of 120%, mainly due to its raw materials (epichlorohydrin/ Bisphenol A) prices continue to rise, the US/European cold wave caused a 62% reduction in factory output, and wind power rushed to install production capacity. Epoxy resin is expected to remain high in the short term, but supply/cost pressure is expected to gradually ease; 3) Glass fiber cloth: Due to the limited supply of new glass fiber in my country and the slow recovery of supply from major high-end electronic yarn producing countries, the stock of glass fiber is low. At the beginning of July 2021, the price of electronic cloth was 8.7-8.8 yuan/meter, +175% year-on-year. With the ignition of the new production line and the increase in production capacity, the price of glass fiber is expected to return to a reasonable level. The price increase momentum of copper clad laminate manufacturers is expected to slow down, and the time when the most cost pressure of PCB manufacturers has passed has passed. The technical barriers of copper clad laminates are high, with CR10 being relatively concentrated at 73%; PCB customization is high/customer stickiness is strong, and the pattern is scattered (CR10<36%), so the bargaining power of copper clad laminate manufacturers is stronger than that of PCB manufacturers. At present, the prices of various raw materials have reached historical highs, and there is limited room for continued rise. Furthermore, copper clad laminate manufacturers have basically shifted cost pressures and increased gross margins after the prices of raw materials have risen. The momentum for continued price increases is expected to slow. The time when PCB manufacturers have the greatest cost pressure has passed, and they are expected to repair their performance through new order price increases and product structure adjustments. The downstream demand is high and the performance growth of PCB manufacturers is highly certain. 1) Base station construction is gradually picking up, and mid- to long-term construction is optimistic. According to Ovum data, global operator capital expenditures are expected to reach a record high of US$360 billion in 2022. The centralized procurement of domestic 5G base stations has been launched from June to July, and the pace of 5G construction has gradually accelerated. 2) The expansion of the cloud computing market and the upgrade of server platforms drive PCB growth. According to IDC data, the global cloud computing market will reach US$291.5 billion in 2020 and is expected to reach US$349.7 billion in 2021. DellOro Group expects data center capital expenditures to resume strong single-digit percentage growth in 2021. CPU update iterations will stimulate further increase in server demand and drive the increase in server PCB volume and price. 3) New energy vehicles continue to be prosperous, and the trend of electrification and intelligence is obvious. According to the China Insurance Regulatory Commission, in the first half of 2021, there were 1.004 million new energy passenger vehicles insured across the country. According to Marklines/SNEResearch forecasts, global electric vehicle sales may reach 5.6 million units in 2021. In the short term, the core shortage of automobiles is expected to gradually alleviate in 2022, driving sales of new energy vehicles; in the long term, the electrification/intelligence of automobiles is still the main theme, and the boom is expected to continue. According to estimates, the gradual penetration of new energy smart vehicles will bring about US$2 to US$3.2 billion in incremental space for global automotive PCBs. According to Prismark, the global automotive PCB output value will reach 8.7 billion U.S. dollars in 2024, with a CAGR of 9.0% in 2020-24. Investment recommendations: 1) Server business is picking up/communication demand is improving quarter by quarter, and the performance of Shennan Circuit and Shenghong Technology is expected to improve; 2) The gross profit margin is severely damaged due to the price increase of copper clad laminate, and Tesla's global main supplier Shiyun Circuit resumes Greater flexibility; 3) The boom in the semiconductor industry is superimposed on the general trend of localization, and Shennan Circuits, which has the ability to mass produce packaging substrates, is developing rapidly. We give the industry a "overweight" rating. Risk reminder: Macroeconomic downturn, trade frictions intensified, and the epidemic is not recovering as expected.

At 10:44 on November 5, the PCB sector index reported 1429.087 points, an increase of 2%, with a turnover of 10.684 billion yuan and a turnover rate of 1.58%. Among the stocks in the sector, the top five stocks with the largest gains were: Zhongfu Circuit reported 29.78 yuan, up 14.63%; Guangdong Junya reported 21.32 yuan, up 10.01%; Chenzhan Optoelectronics reported 32.21 yuan, up 10.01%; Jesse Technology reported 24.62 yuan , Up 8.55%; Dongshan Precision reported 25.49 yuan, up 8.10%.

At present, there are many types of PCB boards, such as high-frequency PCB boards, microwave PCB boards and other types of printed circuit boards that have gained a certain reputation in the market. PCB board manufacturers have specific processing and manufacturing processes for various board types. But overall, the following three aspects need to be considered when PCB processing and manufacturing. Advertising patch processing plant, Shenzhen patch processing plant! Xiaoming patch speed is fast! Small batch 24H shipment, 8H expedited delivery! ^^ Patch processing plant, Shenzhen Xiaoming patch online consultation, offline... Three aspects that need to be considered when PCB board processing 1. Consider the choice of substrate PCB substrates can be divided into two categories: organic materials and inorganic materials, each of which has its own unique advantages. Therefore, the determination of the substrate variety considers various functions such as dielectric function, copper foil type, base groove thickness, and processability characteristics. Among them, the thickness of the surface copper foil is a key factor affecting the function of this printed circuit board. Generally speaking, the thinner the thickness is, the easier it is to etch and the fineness of the graphics have advantages. 2. Consider the setting of production environment The environment of the PCB board processing and manufacturing workshop is also a very important aspect. The regulation of the ambient temperature and the ambient humidity are both crucial factors. If the ambient temperature changes too significantly, it may cause the holes in the base plate to crack. If the environmental humidity is too high, nuclear energy will have an adverse effect on the function of the substrate with strong water absorption, which is specifically manifested in the dielectric function. Therefore, it is necessary to maintain proper environmental conditions when PCB boards are processed and produced. 3. Consider the selection of process flow PCB manufacturing is easily affected by many factors, the number of layers, punching process, surface coating treatment and other processes will affect the quality of PCB board products. Therefore, for these process environment, PCB board processing and manufacturing are fully considered in combination with the characteristics of manufacturing equipment, and can be flexibly adjusted according to different PCB board varieties and processing requirements. The above is the introduction of what problems should be paid attention to when PCB board processing and production? I hope it can help everyone and want to know more PCB board information, please follow us. http://www.pcbcoming.com.

According to a report by South Korean media TheElec, Samsung Electro-Mechanics announced on October 15 that it would terminate its flexible printed circuit board (RFPCB cable) business. Previously, the company had been producing such products at its factory in Vietnam. RFPCB flexible printed circuit board (also called flat cable) is mostly used for the connection of OLED panel and circuit board, camera module and main board. It has high flexibility and very thin thickness, so that the signal can be smoothly transferred from the display control board to the display panel . Previously, Samsung Electro-Mechanics RFPCB's customers were mainly Apple and Samsung Electronics. According to statistics, Apple`s annual sales are about 300 billion won, and Chinese mobile phone manufacturers and Samsung Electronics` annual sales are 100 billion won. However, Samsung Electro-Mechanics loses about 50 billion won (about 272 million yuan) every year. The company said that after exiting the RFPCB business, although sales will decline, overall profitability will improve. Since then, RFPCB flexible printed circuit boards are expected to be sold to BH or Youngpoong Electronic. These two companies have already supplied Apple to Apple. It is expected that they will also take over Apple's orders after acquiring this business.

CB design is a rigorous and careful work. There are many small details in the PCB design process. If some small details are not paid attention to, they may greatly affect the performance of the entire PCB and even determine the success or failure of the entire product. PCB layout specification details 1. In the switching power supply high voltage board, the high voltage and large current signals are completely separated from the low voltage and small current weak signals. 2. In high-frequency digital circuits, crystals and crystal oscillators must be placed close to the chip. The output capacity of the crystal oscillator also has a certain limit. If the crystal oscillator is too far away from the chip layout, the square wave signal output after receiving the crystal oscillator signal inside the chip will be interfered to a certain extent, and it will not be a fixed frequency to a certain extent. , This will cause the digital circuit to be unable to work synchronously. 3. Circuits with the same module and structure adopt a "symmetrical" layout, and the quick layout method can use the module reuse function in the PCB design software. 4. The arrangement of components needs to be considered for later debugging and maintenance, that is, do not place large components around small components; there must be enough space around components that need to be debugged. 5. The decoupling capacitor is close to the IC power supply pin, and the loop between it and the power supply and ground is the shortest. PCB wiring specification details 1. Cross-segmentation: Refers to the signal reference plane is not continuous, the signal line spans two different reference planes, and a series of EMI and crosstalk are generated to the signal. Cross-segmentation in PCB may not have a great impact on low-frequency signals, but for some high-frequency digital circuits, it is very important to avoid cross-segmentation. 2. Pad wire problem: In PCB design, pad wire is also a detail that needs attention. If the two solder pads of the 0402 resistor package are routed diagonally, plus the solder mask deviation caused by the PCB production accuracy (the solder mask window is 0.1mm larger than the solder pad on one side), the result will be as shown in the left picture below. Pad. In this case, due to the effect of the surface tension of the solder during resistance welding, there will be a bad rotation as shown in the right picture below. Adopt a reasonable wiring method, and the pad connection adopts a fan-out method that is symmetric about the long axis, which can effectively reduce the bad rotation after the CHIP component is mounted. If the fan-out line of the pad is also symmetrical about the short axis, the drift after the CHIP component is mounted can also be reduced. And the adjacent network cannot be directly connected to the same network. You need to connect the pads before connecting. As shown in the figure, the straight chain is easy to cause continuous welding during manual welding. 3. Details of equal length in the differential trace pair Compared with ordinary single-ended signal routing, the most obvious advantage of differential signal is its strong anti-interference ability, effective suppression of EMI, and accurate timing positioning. Many designers believe that maintaining equal spacing is more important than matching the length of the line. The most important rule in the design of PCB differential traces is to match the line length. Other rules can be based on it, and the design can be handled flexibly according to the actual application. The following figure lists some detailed methods of internal equal length. 4. Clock signals and high-frequency signals should be shielded as far as possible. If there is no space to cover the ground, try to separate the space of 3W. 5. When wiring and punching holes, you need to pay attention to the splitting of the reference plane of the adjacent layer. Such a split will cause the signal transmission path to be too long. It is better to keep a distance between the holes and the holes that can pass a line, so as to prevent the plane layer from being cut. Affect the integrity of the reference plane. Production details in PCB design 1. The details of the golden finger window opening: I believe everyone has known about the golden finger window. During the design process, you must pay attention to this small detail of the golden finger window opening. The golden finger area must be fully opened. Some designers When packaging, the window area will be added to prevent forgetting to add it in the PCB later. Of course, some careless engineers will forget this small detail, resulting in a huge discount in the performance and service life of the product after the PCB is produced. Among them, the processing method of opening the window in the PCB: draw the window area in the solder mask area corresponding to the gold finger, which can be drawn with copper or 2D lines. The role of golden finger window opening: golden finger window opening means that there is no green oil between the device pad and the pad, so as to avoid long-term plugging and plugging and causing the green oil to fall off, thereby affecting the performance and quality of the product. Device pad tombstone phenomenon: This detail involves the PCB packaging design, and it is also a little bit related to the method of pad wiring introduced to you before. PCB packaging is also very important for PCB design. The packaging on the PCB board is the mapping of the actual device, so when designing the package, it must be noted that the pad design should strictly maintain symmetry, and the design size should not be too different from the actual size. . For example, for resistance-capacitance packaging, the pads on both sides need to be symmetrical and have the same size to ensure that when the solder melts, the surface tension of all solder joints on the components can be balanced, and ideal solder joints have been formed. The pad is asymmetrical. During reflow soldering, the solder on the larger end of the pad cannot achieve the desired melting and wetting effect, causing the device to shift and tombstone this phenomenon.

According to the Securities Star Data Center, Chaohua Technology`s daily limit closed at 10.41 yuan. The stock's daily limit was opened at 14:29, and the daily limit was opened once. As of the closing of the market, the capital of the seal was 72,192,700 yuan, accounting for 0.87% of its circulating market value. In terms of capital flow data, on that day, the main net inflow of funds was 123 million yuan, the net inflow of hot money was 151 million yuan, and the net outflow of retail funds was 59,171,600 yuan. The stock is a lithium battery, PCB board, and domestic chip concept hot stock. On the day, the lithium battery concept rose 0.39%, and the PCB board concept rose 0.06%. The investment logic of the stock is as follows: 1. The company has an annual production capacity of 12,000 tons of copper foil, becoming one of the few domestic companies with a production capacity of over 10,000 tons of high-precision copper foil, and has the mass production capacity of 6um lithium battery copper foil and high-frequency high-speed copper foil; lithium battery copper foil It is an important lithium battery anode material. The company`s main customers of lithium battery copper foil are well-known lithium ion battery manufacturers at home and abroad; in 19 years, the company`s copper foil revenue was 493 million yuan, accounting for 37.31%; the company`s annual output of 8,000 tons of high-precision electronic copper foil Engineering (Phase II) project" is proceeding in an orderly manner. After the project is put into operation, the company's copper foil production capacity will reach 20,000 tons. 2. A small number of vertically integrated industrial chain production companies in the PCB industry are capable of providing copper foil substrates, single-sided printed circuit boards, double-sided multilayer printed circuit boards, special wood pulp paper for copper clad laminates, drilling and laminating processing The production and service capabilities of the entire industry chain product line, including the production of flexible circuit board copper foil; PCB production capacity of 7.4 million square meters per year, 20 years of circuit board revenue of 481 million, accounting for 37.63% 3. As one of the world's leading G.hn chip design companies, Xindi Semiconductor (holding 11.77%), the shareholding company, provides integrated circuit chips and core software for "smart homes" and "smart cities", and its products cover telecommunications and charging piles. , Smart home and other fields, the company will also actively promote the rapid development of Xindi Semiconductor From the perspective of financial status, Chaohua Technology`s 2021 mid-year report shows that the company`s main operating income was 1.197 billion yuan, a year-on-year increase of 125.05%; net profit attributable to the parent was 73.577 million yuan, a year-on-year increase of 286.47%; non-net profit was 91.216 million yuan, a year-on-year increase 543.65%; debt ratio 54.83%, investment income of 2.3338 million yuan, financial expenses of 36.8659 million yuan, and gross profit margin of 22.59%.

Securities Star Data Center News, Dongfang Materials (603110, stocks) closed its daily limit and closed at 31.03 yuan. The stock has a daily limit at 14:45, but the daily limit has not been opened. As of the closing of the market, the capital of the closing list was 2,746,700 yuan, accounting for 0.04% of its circulating market value. In terms of capital flow data, on the day, the net inflow of main funds was 9,892,800 yuan, the net inflow of hot money was 6,882,700 yuan, and the net outflow of retail funds was 7,067,000 yuan. The stock is a graphene, PCB board concept hot stock, the graphene concept rose 2.3% on the day, and the PCB board concept rose 0.36%. 1. Belonging to the downstream of the industrial chain, the company has been paying attention to the technical trends in the application of graphene new materials, and is committed to expanding the application of graphene Based on some mature ink resin R&D and production technologies, we develop binder resins for electronic inks suitable for graphene applications. With the help of Duoling Technology`s existing graphene production and application technologies, we will further cooperate in the development of electrical and thermal conductivity applications. Electronic ink products and other graphene products; in June 19, the wholly-owned subsidiary Dongfang Ink and Duoling New Materials jointly developed electronic ink products based on graphene applications, which are about to enter the mass production stage 2. In the field of PCB materials, PCB electronic inks produced can be used for the production of electronic circuit boards From the perspective of financial status, the 2021 mid-year report of Oriental Materials shows that the company's main operating income is 180 million yuan, an increase of 0.97% year-on-year; the net profit attributable to the parent is 51.317 million yuan, an increase of 78.39%; the deduction of non-net profit is 12,922,600 yuan, a year-on-year decrease of 46.42 %; the debt ratio is 18.32%, the investment income is 1.0604 million yuan, the financial cost is 2.269 million yuan, and the gross profit rate is 33.34%. The Securities Star valuation analysis tool shows that the stock is a good company with a rating of 2.5 stars, a good price rating of 1.5 stars, and a comprehensive valuation rating of 2 stars.

For a long time, glass substrates and PCB boards have maintained a "clearly distinct" situation, and both have played their own advantages in different occasions. Among them, glass substrates are mainly used by liquid crystal panel companies, and are generally used in the panel process; PCB boards are used in all integrated circuit electronic devices. Relatively speaking, the application range of PCB boards is wider and wider than that of glass substrates. However, with the advancement of display technology, this balance has gradually been broken. The glass substrate and PCB board have a tendency of mutual penetration, especially in the field of new display technology such as Mini/Micro LED. Enterprises are faced with whether to choose glass substrate or The problem of choosing a PCB board as a carrier. Dai Zhiming, chairman of Lanpu Video, once said that one of the key points of mass transfer technology is the choice of using glass substrates to transfer chips or PCB boards. How to choose the backplane? There are different voices in the industry. Among them, liquid crystal panel companies tend to use glass substrates as backplanes for Mini/Micro LEDs, while large LED packaging manufacturers mainly promote PCB board solutions to produce Mini/Micro LED products. This is because glass substrates and PCB boards are the main raw materials for liquid crystal panel companies and LED display production and manufacturing, respectively, and the use of glass substrates or PCB boards as the backplane of Mini/Micro LED products can achieve a high degree of integration between the product and the industry chain. , The technology is more mature and easier to use. However, no matter what technical solution is adopted, both have their own advantages and disadvantages and cannot be generalized. For example, from a performance point of view, the glass substrate has high thermal conductivity and can dissipate heat better. It can also meet more complex wiring requirements on higher-density soldering products; in addition, the flatness of the glass substrate is higher, It is easier to achieve breakthroughs in chip transfer technology, which is also the most prominent advantage of glass substrates in the application process. Compared with the glass substrate, the PCB board has poor heat dissipation due to the limitation of the material itself, and is prone to warpage and deformation during large-size applications. Therefore, in terms of performance, the glass substrate has more advantages than the PCB board. The advantages of glass substrates are not only manifested in performance, but also in terms of cost. Glass substrates also have incomparable advantages. Due to its own reasons, traditional PCB boards cannot meet the requirements of emerging display products in terms of stability and accuracy. It is necessary to import high-end PCB board products from abroad to make up for this defect, which increases the cost and makes PCB products The price has remained high. Qiu Yun, deputy director of the technical planning department of the BOE Display and Sensors Business Group Organization, once said: "Currently, the 6-layer 2-layer and 8-layer 3-layer PCB substrates required for Mini LED backlights are basically not available in batches in China, and can only be imported at high prices." . Compared with PCB boards, glass substrates can avoid these problems and can realize stable applications of emerging display products. The relevant person in charge of TCL also pointed out that the supply of glass materials is relatively stable and the cost is relatively low. For example, using glass instead of PCB for LED backplanes can greatly reduce manufacturing costs. Although the glass substrate has unique advantages in terms of performance and cost, its performance in terms of yield is a "fault" that has to be discussed. The raw material of the glass substrate is plain glass, which is fragile and vulnerable. In the process of production and handling, physical damage such as collisions and scratches is inevitable, so that the product is broken, which affects the production yield. However, PCB boards have been developed for a long time, with higher maturity and relatively complete supply chains, and the yield rate is increasing year by year. Therefore, compared with the glass substrate, the yield advantage of the PCB board is more acceptable to people. Comprehensive analysis shows that glass substrates and PCB boards have their own advantages and disadvantages, and the betting directions of companies are also different. As for who will win the final victory, it is still unknown. However, in recent years, with the continuous development of Mini/Micro LED products, the dispute between glass substrates and PCB boards has gradually been mentioned. At present, a view recognized in the display industry is that it is still a good choice to use PCB boards as Mini/Micro LED backplanes at this stage, but with the advancement of glass substrate technology, glass substrates will show even more excellent performance. score". Why is there such a statement? This is a comprehensive decision based on various current situations. The current LED display industry has three mainstream packaging technologies, SMD, IMD, and COB. These three technologies have already occupied a large share of the market due to a long development time and relatively mature technology. In addition, COB technology is an integrated packaging technology with unlimited potential and is hailed as the key technology most likely to break through Mini/Micro LED products. Although SMD, IMD and COB can meet the huge demand of current LED display products, as the dot pitch of LED display continues to shrink, the required precision is getting higher and higher. In order to meet the requirements of IC wiring, It is necessary to increase the level of the display PCB board, as a result, the original process of the PCB board is facing an unsustainable situation. Therefore, companies and experts in the display industry have focused their attention on glass-based COG technology and improved it. COG, the abbreviation of Chip on glass, directly encapsulates the driver IC on glass through anisotropic conductive glue, which has a good packaging effect. At present, many LED companies have improved the traditional COG technology and applied it to new display products such as Mini/Micro LED. It is understood that in July 2020, the new generation of Mini COG products of NationStar Optoelectronics has been lighted up. NationStar`s Mini COG solution uses glass-based technology, that is, to mount chips directly on the glass substrate. This solution has the advantages of good heat dissipation, high cost, and high brightness. More importantly, the process does not cause any damage to the glass. , High efficiency and good consistency, solve the frequent quality damage problem of Mini COG in the manufacturing process. It is understood that National Star Optoelectronics has launched the first generation of Micro LED display product nStar Ⅰ in 2020. The product also uses a glass substrate process, which can help to achieve a passive drive Micro LED full-color display.

Recently, Ganzhou Yihao New Materials Co., Ltd. ("Yihao New Materials", the company), which is mainly engaged in the research and development, production and sales of electronic circuit copper foil and its downstream aluminum-based copper clad laminates, has entered an inquiry state for its IPO. The institution is Guosen Securities (12.510, 0.26, 2.12%). Electronic circuit copper foil, also known as PCB copper foil and standard copper foil, is an important material for the manufacture of copper clad laminates and printed circuit boards (PCB). PCB, as the "mother of electronics", has a wide range of downstream applications. According to Prismark data, the growth of my country's PCB output value slowed down in 2019, maintaining a growth rate of 0.7%; in 2020, the PCB output value was approximately US$35.1 billion, a year-on-year increase of approximately 6.4%. Yihao New Materials, whose electronic circuit copper foil income accounts for about 70% of its main business income, benefited from the growth of the downstream PCB market in 2020, and the company's operating performance has improved. In the first half of 2021, the gross profit margin of the company's electronic circuit copper foil has surged by more than 10 percentage points to 26.81%. However, the cost of raw material procurement has also increased during the same period. It is also worth paying attention to which product or raw material has a faster price increase. The actual controller was involved in a bribery case Before the IPO, Yihao Group directly held 69.42% of the company`s shares and was the company`s controlling shareholder. Zhang Jianmeng directly held 5.27% of the company`s shares and indirectly controlled 69.42% of the company`s shares by controlling Yihao Group. Zhang Jianmeng also serves as the chairman and general manager of the company, and Zhang Xinchen indirectly controls 14.20% of the company's shares through Hong Kong Yiyuan, and serves as a director of the company. The two are father-son relationships and control 88.89% of the company's shares in total. They are the joint actual controllers. It is worth noting that Zhang Jianmeng, one of the actual controllers, was implicated in a bribery case. Zhang Jianmeng once assisted in the investigation of a suspected crime of serious duty violation by Yang Zhijun, the former director of Zhanggong Branch of Ganzhou Environmental Protection Bureau (hereinafter referred to as the "Yang Zhijun Case") at the request of the case handlers of the Zhanggong District Supervisory Committee of Ganzhou City. The prospectus shows that the Yang Zhijun case has been finalized by the Ganzhou Intermediate People`s Court in Jiangxi Province in March 2019, convicting Yang Zhijun of taking bribes and sentenced him to punishment. According to Yang Zhijun`s second-instance criminal ruling on bribery (2019) Gan 07 Xing Zhong No. 75), in early June 2017, Yang Zhijun demanded RMB 182,000 from Zhang Jianmeng in the name of the money for tobacco and alcohol, in order to avoid difficulties for the company`s environmental protection work. Zhang Jianmeng agreed to his request. In addition, Yang Zhijun accepted Zhang Jianmeng's meal coupons worth RMB 20,000. On March 17, 2021, the People`s Procuratorate of Zhanggong District, Ganzhou City issued a [Statement Statement" confirming that when handling the Yang Zhijun case, there was no evidence of Zhang Jianmeng`s suspected criminal case filed in the evidence transferred for prosecution, and no criminal case was filed against him. Allegations. Subsequently, on March 18, the Zhanggong District Supervisory Committee of Ganzhou City issued a "Statement Statement" confirming that the investigation of Yang Zhijun's case had been completed according to law and that the court had also completed the trial according to law. Zhang Jianmeng actively cooperated with the investigation. In this case, Zhanggong District, Ganzhou City The Supervisory Committee has not filed an investigation into Zhang Jianmeng, nor will he be held responsible for the case. In addition, Yihao New Material itself is also involved in two litigation disputes. One of them is a sales contract dispute: As of June 30, 2021, Yihao New Materials should be due to Yangzhou Chengyi Optoelectronics Trading Co., Ltd. (hereinafter referred to as "Chengyi Optoelectronics") for the payment of 6,185,400 yuan. The company signed a tripartite guarantee agreement with Chengyi Optoelectronics and Yangzhou Junmao Optoelectronics Co., Ltd. (hereinafter referred to as "Junmao Optoelectronics"). The agreement stipulates that Junmao Optoelectronics will use its own property to guarantee all debts incurred by Chengyi Optoelectronics and the company`s business . In July 2021, the company filed a lawsuit in the People`s Court with Chengyi Optoelectronics and Junmao Optoelectronics as the defendants. The litigation request is: order the defendant Chengyi Optoelectronics to pay 6,185,400 yuan for the goods and liquidated damages for overdue payments; order the defendant Junmao Optoelectronics to The defendant assumed the joint guarantee liability for payment obligations of Yiguang Optoelectronics. The case is still under trial. The other was a contract dispute over general transfer of claims and debts: Ganzhou Zhanggong District State-owned Industrial Assets Management Co., Ltd. (hereinafter referred to as "Zhanggong District State-owned Assets Management Company") filed a lawsuit with the company as the defendant in the Zhanggong District People`s Court of Ganzhou City, Jiangxi Province. The court order: (1) The company fulfilled the "Reconciliation Agreement" and paid a penalty of 1,039,221.78 yuan to the state-owned company in Zhanggong District; (2) All the litigation costs in this case were borne by the company. The company filed a counterclaim and added Tianyin Communication Holdings Co., Ltd. as a third party, and appealed for an order: (1) Zhanggong District State-owned Assets Co., Ltd. immediately returned the Yihao New Material payment of 1,039,146.72 yuan and interest (the interest is from the lawsuit) Calculated at an annual interest rate of 6% from the date until the payment is paid off); (2) The counterclaim costs in this case shall be borne by the Zhanggong District State-owned Assets Company. On December 22, 2020, according to the judgment results, (1) the company paid 852,13399 million yuan of overdue interest to the Zhanggong District State-owned Company within seven days from the effective date of the judgment; (2) the company`s counterclaim was rejected. Then on January 7, 2021, the company filed an appeal and petitioned for an order, but on July 12, the Ganzhou Intermediate People's Court of Jiangxi Province rejected the appeal and upheld the original judgment. In August, the company has paid overdue interest to the state-owned company in Zhanggong District. At the same time, the company has issued a "retrial application" and plans to submit it to the Jiangxi Higher People's Court. The strong demand for PCB drives the company's performance Electrolytic copper foil is made from copper raw materials into copper sulfate solution, and then electrolytic equipment is used to electrolytically deposit the copper sulfate solution under the action of direct current. According to the different application fields, it can be divided into electronic circuit copper foil and lithium battery copper foil. Electronic circuit copper foil is an important material for the manufacture of copper clad laminates and printed circuit boards (PCBs). PCBs are key electronic components in modern electronic equipment. Terminals are widely used in consumer electronics, 5G communications, Internet of Things, big data, Cloud computing, artificial intelligence, new energy vehicles, industrial control medical, aerospace and many other fields. According to the data of the CCLA Industry Association, in 2020 my country's electronic circuit copper foil demand, PCB electronic circuit copper foil accounted for 28.57%, and copper clad laminate electronic circuit copper foil accounted for 71.43%. Unlike most companies in the industry, which are mainly copper clad laminate customers, the company's electronic circuit copper foil customers are mainly PCB customers. In 2020, the company's sales of electronic circuit copper foil to PCB customers accounted for 58.47% of the company's total sales of electronic circuit copper foil. The downstream of Yihao New Materials mainly cooperates with Tripod Technology, Jingwang Electronics (25.890, -0.17, -0.65%), Shenghong Technology (25.420, 0.15, 0.59%), Suntak Technology (12.870, 0.12, 0.94%), five plants Well-known companies in the PCB industry such as Science and Technology, Shiyun Circuits (15.970, -0.04, -0.25%) and CCL industries such as Shengyi Technology (23.710, -0.02, -0.08%) and Nanya New Materials (48.260, 1.13, 2.40%) Well-known companies have established long-term and stable cooperative relations. During the reporting period (2018-June 2021), Yihao New Materials realized operating revenues of 588 million yuan, 756 million yuan, 838 million yuan, and 638 million yuan respectively; the net profits after deducting non-recurring gains and losses in the same period were respectively 18.21 million yuan, 24.4052 million yuan, 55.723 million yuan and 95,246,100 yuan. Jiemian News reporters checked the prospectus and found that the company`s rapid growth in revenue and non-net profit in the first half of 2021 is mainly related to the rapid growth in the sales revenue of electronic circuit copper foil, which is mainly due to the downstream PCB industry. The market demand is strong. Specifically, since the second half of 2020, the rapid growth in demand in the downstream PCB industry has led to tight supply and demand in the electronic circuit copper foil industry, and the copper market price has risen, and the sales unit price has increased. At the same time, the company's electronic circuit copper foil production and sales have increased significantly in 2018. Add a new production line with an annual output of 2,600 tons of copper foil for electronic circuits. The company's current production capacity is 10,200 tons/year, but the company's capacity utilization rate and production-sales rate in the first half of 2020 and 2021 are both greater than 100%, and production capacity is severely saturated state. In this IPO, Yihao New Materials intends to raise 746 million yuan of funds, of which 587 million yuan will be used for the 10,000-ton high-precision electrolytic copper foil project, which is implemented by the company and belongs to "an annual increase of 20,000 tons of high-end electrolytic copper foil. The first phase of the "Production Line Reconstruction and Expansion Project" has a construction period of 24 months. According to Prismark data, my country's PCB output value in 2020 is about 35.1 billion U.S. dollars, a year-on-year increase of about 6.4%. HSBC Qianhai Securities predicts that my country's PCB output value will grow at a compound annual growth rate of about 8% from 2020 to 2025. It is estimated that by 2025, my country's PCB output value will reach 51.7 billion U.S. dollars, and its share of the global PCB market will reach 60%. As shown in the figure, the company's electronic circuit copper foil output in 2020 ranks sixth among domestic holding companies in the country. If the company's fundraising projects are successfully put into production in the future, the company's market share will be given the rapid development of the downstream PCB industry market. Will be further improved. In addition, Jiemian News reporters also noticed that the first phase of the Yihao New Material PCB project is expected to be put into operation in the second half of 2021, further strengthening the advantages of the vertical integration industry chain. After the PCB project is put into production, the company`s aluminum-based copper clad laminates will gradually be converted to self-use Mainly, the company's product structure will also undergo certain changes by then. Concentration of raw material procurement increases risks The prospectus disclosed that the company`s main business costs were mainly direct materials, accounting for 78.25%, 79.11%, 79.08%, and 81.63% in each period of the reporting period. Therefore, the raw material procurement cost was significantly linked to gross profit. Among them, the main raw material of electronic circuit copper foil products is copper, auxiliary materials are sulfuric acid, etc., and the main raw materials of aluminum-based copper clad laminate products are copper foil and aluminum plate. In 2020, especially since 2021, the purchase price of copper and aluminum plates has increased significantly, so what is the company's ability to deal with the risk of rising raw materials? In fact, in the aforementioned analysis, it can be seen that the company has increased prices on the sales side, and the price increase is as shown in the figure above. It is worth noting that there is an indicator-gross profit margin is more clear and intuitive. During the reporting period, the company`s electronic circuit copper foil gross profit margin was 16.75%, 12.97%, 15.70%, and 26.81%. It is not difficult to see that the gross profit margin from 2018 to 2020 first dropped and then rose, while in the first half of 2021, the gross profit margin increased by more than 10 percentage point. Judging from the gross profit margin in the first half of 2021, even in the case of rising raw material costs, the company's electronic circuit copper foil sales have good bargaining space, which can effectively bridge the cost pressure. As of September 8, Shanghai copper's main contract price was 68680 yuan/ton, so the gross profit margin in the second half of the year will further reflect the ability to deal with raw material risks. In terms of the top five suppliers, during the reporting period, the company's largest supplier was Shanghai Hengyue Trading Co., Ltd. (referred to as "Shanghai Hengyue"), and the purchase content was copper cathode. In 2018 and 2019, the company's purchases from this supplier were 159 million yuan and 177 million yuan, accounting for less than 30% of the total purchases. In 2020 and the first half of 2021, they were 348 million yuan and 280 million yuan respectively. , Accounting for 46.27% and 45.88% respectively. The reason is that in 2020, the company and Trafigura Investment (China) Co., Ltd. (referred to as Trafigura Investment), as the two parties could not reach an agreement on payment terms and delivery volume, terminated the cooperation after the contract expires in April 2020, thereby increasing Increased the purchase of copper cathodes from Shanghai Hengyue. Therefore, Yihao New Material`s reliance on Shanghai Hengyue`s procurement is worthy of attention. On the one hand, Shanghai Hengyue, as an old customer of the company, has certain bargaining power under the condition of rising cathode copper purchase prices. Hengyue`s cooperation such as Trafigura`s investment was temporarily suspended, which will have a greater impact on the company`s procurement costs. In terms of copper wire customers, during the reporting period, the company mainly purchased Shangrao Haoyu Copper Co., Ltd. ("Haoyu Copper"). In the first half of 2021, the new customer Jiangtong East China (Zhejiang) Copper Co., Ltd. ( (Referred to as "East China Copper"), the purchase amount was 33.9814 million yuan, while the purchase amount of Haoyu Copper was 42.086 million yuan in the same period.

After the PCB board has been used for a period of time, cleaning is indispensable. There are many cleaning methods, and each has its own advantages and disadvantages. You need to choose by yourself. Since the development of cleaning technology, the following four technologies have been widely used. 1. Water cleaning technology As the future development direction of water cleaning technology, it is necessary to set up pure water source and discharge water treatment workshop. It uses water as the cleaning medium, and adds surfactants, additives, corrosion inhibitors, chelating agents, etc. to the water to form a series of water-based cleaning agents. Can remove non-polar contaminants and water solvents. The characteristics of the cleaning process are: 1) Good safety, non-burning, basically non-toxic; 2) The formulation of the cleaning agent has a large degree of freedom, a wide cleaning range, and it is easy to clean both polar and non-polar pollutants; 3) Multiple cleaning mechanisms. Water is a very polar solvent. In addition to dissolving, it also has saponification, displacement, and dispersion. The use of ultrasound is much more effective than in organic solvents; 4) As a natural solvent, its price is relatively low and its sources are wide. The disadvantages of water cleaning are: 1) In areas where water resources are scarce, because this cleaning method consumes a lot of water resources, it is limited by the local natural conditions; 2) Departmental components cannot be cleaned with water, and metal parts are easily rusted; 3) The surface tension is large, it is difficult to clean the small gaps, and it is difficult to completely remove the residual surfactant; 4) It is difficult to dry and consumes a lot of energy; 5) The cost of the equipment is high, a wastewater treatment device is required, and the equipment occupies a large area. 2. Semi-aqueous cleaning technology Semi-aqueous cleaning mainly uses deionized water and organic solvents, and then adds a cleaning agent composed of some appropriate active agents and additives. This type of cleaning is between solvent cleaning and water cleaning. These cleaning agents are all organic solvents and are flammable solvents with relatively high ignition point and relatively low toxicity. The characteristics of the semi-aqueous cleaning process are: 1) The cleaning ability is relatively strong, which can remove polar and non-polar pollutants at the same time, and the cleaning ability is strong; 2) Two different types of media are used for cleaning and rinsing, and pure water is generally used for rinsing; 3) Dry after rinsing. The disadvantage of this technology is that the treatment of waste liquid and wastewater is a relatively complicated problem that has yet to be completely solved. 3. Solvent cleaning technology Solvent cleaning mainly uses the solvent's solvency to remove contaminants. Solvent cleaning is used, because it evaporates quickly and has a strong dissolving ability, so the requirements for the equipment are very simple. And his cleaning agent can also be divided into flammable cleaning agent and non-flammable cleaning agent, flammable cleaning agent mainly includes organic hydrocarbons and alcohols (such as organic hydrocarbons, alcohols, glycol esters, etc.), non-flammable The properties mainly include chlorinated hydrocarbons and fluorinated hydrocarbons (such as HCFC and HFC). HCFC cleaning agent and its cleaning process characteristics: This is a hydrogen-containing chlorofluorocarbon with low latent heat of evaporation and good volatility. It is easily decomposed in the atmosphere and has a relatively small effect on destroying the ozone layer. It is a transitional product and is scheduled to be phased out before 2040. Recommended Use. Characteristics of the cleaning process of chlorinated hydrocarbons: Chlorinated hydrocarbons such as dichloromethane and trichloroethane are also non-ODS cleaning agents. The characteristics of the cleaning process are: 1) The ability to clean grease and dirt is particularly strong; 2) Like the ODS cleaning agent, it can also be washed with steam and dried in the gas phase; 3) The cleaning agent does not burn or explode, and is safe to use; 4) The cleaning agent can be distilled and recycled and used repeatedly, which is more economical; 5) The cleaning process is also the same as the ODS cleaning agent. However, its shortcomings are that the toxicity of chlorinated hydrocarbons is relatively high, and safety issues in the workplace should be paid special attention; the second is that the compatibility of chlorinated hydrocarbons with general plastics and rubber is poor; the third is that chlorinated hydrocarbons are not disorderly. The above is relatively poor, so you must add no messy agent when using it. Characteristics of hydrocarbon cleaning process: Hydrocarbons are hydrocarbons. In the past, gasoline and kerosene obtained by distilling crude oil were used as cleaning agents. With the increase of carbon number, the flash point of hydrocarbons increases, which increases safety, but the dryness is not good; the dryness is good, and it is not safe to use, so the two are very contradictory. Of course, as the cleaning agent, a cleaning agent with good fire safety and high flash point should be used as much as possible. The characteristics of the cleaning process are: 1) It has strong cleaning ability for grease and dirt, strong long-lasting cleaning ability, and low surface tension, which has a good cleaning effect on crevices and pores; 2) Does not corrode metals; 3) It can be distilled and recycled and used repeatedly, which is more economical; 4) Low toxicity and less environmental pollution; 5) The same medium can be used for cleaning and rinsing, which is convenient to use. The most important of the shortcomings of the hydrocarbon cleaning process is the problem of safety, which requires strict safety methods and measures. Characteristics of alcohol cleaning process: Among the alcohols, ethanol and isopropanol are organic polar solvents commonly used in the industry. Methanol is more toxic and is generally only used as an additive. The characteristics of the alcohol cleaning process are: 1) It has a good dissolving ability for ionic pollutants, and the cleaning effect of rosin flux is very good, and the dissolving ability for oils is weak; 2) It has good compatibility with metal materials and plastics, and does not produce erosion and swelling; 3) Fast drying, easy to dry or air drying, no need to use hot air; 4) It has good dehydration properties and is often used as a dehydrating agent. The main problem of alcohol cleaning agents is high volatility, low flash point, and easy combustion. It is necessary to take explosion-proof measures for cleaning equipment and auxiliary equipment. 4. No-cleaning technology No-clean flux or no-clean solder paste is used in the soldering process. After soldering, it will go directly to the next process and no longer be cleaned. No-clean technology is currently the most commonly used alternative technology, especially mobile communication products. Wash method to replace ODS. At present, many kinds of no-clean fluxes have been developed at home and abroad. No-clean fluxes can be roughly divided into three categories: 1) Rosin type flux: Inert rosin solder (RMA) is used for reflow soldering, which can be free of cleaning. 2) Water-soluble flux: clean with water after welding. 3) Low solid content flux: no cleaning. No-clean technology has the advantages of simplifying the process flow, saving manufacturing costs and reducing pollution. In the past ten years, the widespread use of no-clean soldering technology, no-clean flux and no-clean solder paste is a major feature of the electronics industry at the end of the 20th century. The ultimate way to replace CFCs is to achieve no-clean. The above four cleaning methods have their own advantages and disadvantages. I like that you can choose the method according to your actual situation.